pb lead-free parts - 2007 08 - mar. doc. no : qw0905-l9sef45840/s11-pf rev. : a date : data sheet ligitek electronics co.,ltd. property of ligitek only super bright rectangle type led lamps l9sef45840/s11-pf
1.9 4.0 3.2 0.5 typ 1.5 max 2.54typ 1.0min 27 0.5 note : 1.all dimension are in millimeter tolerance is 0.25mm unless otherwise noted. 2.specifications are subject to change without notice. directivity radiation ligitek electronics co.,ltd. property of ligitek only package dimensions part no. l9sef45840/s11-pfpage 1/5 + -
electrostatic discharge( * ) operating temperature typical electrical & optical characteristics (ta=25 ) note : 1.the forward voltage data did not including 0.1v testing tolerance. 2. the luminous intensity data did not including 15% testing tolerance. l9sef45840/s11-pf part no algainp material storage temperature reverse current @5v dominant wave length dnm luminous intensity @20ma(mcd) viewing angle 2 1/2 (deg) spectral halfwidth nm forward voltage @20ma(v) color orange diffused orange emitted lens 17 2.6 max. 1.7 min. 90 min. 140 160 typ. 2000 -40 ~ +100 -40 ~ +85 tstg esd t opr ir10 v a absolute maximum ratings at ta=25 forward current power dissipation peak forward current duty 1/10@10khz parameter 9sef ratings ligitek electronics co.,ltd. property of ligitek only i fp pd i f symbol 60 75 30 ma mw ma unit page 2/5 static electricity or power surge will damage the led. use of a conductive wrist band or anti-electrosatic glove is recommended when handing these led. all devices, equipment and machinery must be properly grounded. * 605 part no. l9sef45840/s11-pf
fig.3 forward voltage vs. temperature fig.5 relative intensity vs. wavelength ambient temperature( ) r e l a t i v e i n t e n s i t y @ 2 0 m a wavelength (nm) f o r w a r d v o l t a g e @ 2 0 m a n o r m a l i z e @ 2 5 fig.4 relative intensity vs. temperature ambient temperature( ) r e l a t i v e i n t e n s i t y @ 2 0 m a n o r m a l i z e @ 2 5 forward voltage(v) fig.1 forward current vs. forward voltage f o r w a r d c u r r e n t ( m a ) forward current(ma) fig.2 relative intensity vs. forward current r e l a t i v e i n t e n s i t y n o r m a l i z e @ 2 0 m a ligitek electronics co.,ltd. property of ligitek only 1.0 0.1 1.0 10 100 1000 1.0101001000 0.0 0.5 1.0 1.5 2.0 2.5 3.0 -40-200204060 1.0 1.1 1.2 550 600650 0.0 0.5 1.0 2.03.04.05.0 80100 0.8 0.9 -20 -40 40 20 080100 60 2.0 0.0 0.5 1.0 1.5 2.5 3.0 500 typical electro-optical characteristics curve 9sef chip page 3/5 part no. l9sef45840/s11-pf
temp( c) 25 0 0 120 260 2 /sec max preheat 50 5 /sec max 100 260 c3sec max 150 time(sec) dip soldering preheat: 120 c max preheat time: 60seconds max ramp-up 2 c/sec(max) ramp-down:-5 c/sec(max) solder bath:260 c max dipping time:3 seconds max distance:2mm min(from solder joint to body) soldering condition(pb-free) 1.iron: soldering iron:30w max temperature 350 c max soldering time:3 seconds max(one time only) distance:2mm min(from solder joint to body) ligitek electronics co.,ltd. property of ligitek only 2.wave soldering profile page 4/5 60 seconds max note:1.wave solder should not be made more than one time. 2.you can just only select one of the soldering conditions as above. part no. l9sef45840/s11-pf
the purpose of this is the resistance of the device which is laid under condition of high temperature for hours. solderability test solder resistance test thermal shock test high temperature high humidity test low temperature storage test mil-std-202:103b jis c 7021: b-11 mil-std-202: 208d mil-std-750: 2026 mil-std-883: 2003 jis c 7021: a-2 mil-std-202: 210a mil-std-750: 2031 jis c 7021: a-1 mil-std-202: 107d mil-std-750: 1051 mil-std-883: 1011 jis c 7021: b-12 1.t.sol=230 5 2.dwell time=5 1sec 1.t.sol=260 5 2.dwell time= 10 1sec. 1.ta=105 5 &-40 5 (10min) (10min) 2.total 10 cycles 1.ta=65 5 2.rh=90%~95% 3.t=240hrs 2hrs 1.ta=-40 5 2.t=1000 hrs (-24hrs, +72hrs) this test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. this test intended to see soldering well performed or not. the purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. the purpose of this test is the resistance of the device under tropical for hours. the purpose of this is the resistance of the device which is laid under condition of low temperature for hours. reliability test: high temperature storage test operating life test test item mil-std-750: 1026 mil-std-883: 1005 jis c 7021: b-1 mil-std-883:1008 jis c 7021: b-10 ligitek electronics co.,ltd. property of ligitek only 1.under room temperature 2.if=20ma 3.t=1000 hrs (-24hrs, +72hrs) 1.ta=105 5 2.t=1000 hrs (-24hrs, +72hrs) test condition description this test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed. reference standard page 5/5 part no. l9sef45840/s11-pf
|
